A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for ...

This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation ...

Test your BGA153 device using high performance 31GHz spring pin socket and low 14g force per pin. Small footprint (only 2.5mm larger than device per side) allows capacitors ... Ironwood Electronics ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Telecom networks are evolving rapidly to handle higher ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Telecom networks are evolving rapidly to handle higher ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Telecom networks are evolving rapidly to handle higher ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Discover how the optional patented turret ...

CEA-Leti and Soitec announced a strategic partnership to enhance the cybersecurity of integrated circuits (ICs) through the innovative use of fully depleted silicon-on-insulator ... Semiconductor ...

Agileo Automation announced the future expansion of its A²ECF-SEMI automation framework to include SEMI's EDA (Equipment Data Acquisition) standards suite. This ... Agileo Automation ...

Syensqo has introduced the market's first peroxide-curable FFKM polymers made entirely without fluorosurfactants from the PFAs family of chemicals, using its proprietary ...

Semiconductor Packaging News - Exclusive: Univ. of Michigan Research Study Demonstrates Novel Synthesis Using Veeco's Fiji ALD System ...

STMicroelectronics has unveiled STPay-Topaz-2, its next-generation contactless payment card system-on-chip (SoC), offering more flexibility to support a wider variety ... DCP0606Y automotive step-down ...