A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for ...

TrueFlat technology uses negative pressure reflow and Advanced Thermal Control (ATC) to reduce warpage, micro spikes, and CTE mismatch defects in ultra-miniaturized electronic assemblies with fragile ...

This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation ...

Leading IC manufacturing and technology services provider increases chip-on-wafer (CoW) yield by 3.3% from 96.47% to 99.66% with Nordson Electronics Solutions ...

Test your BGA153 device using high performance 31GHz spring pin socket and low 14g force per pin. Small footprint (only 2.5mm larger than device per side) allows capacitors ... Ironwood Electronics ...

Yole Group announces the release of its annual Status of the Advanced IC Substrates Industry report, a comprehensive market and technology analysis covering organic IC ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Brewer Science offers temporary bonding solutions with ...

ClassOne Technology announced its first Canadian customer, the Université de Sherbrooke, has purchased a Solstice® LT single-wafer processing system for advanced packaging ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Brewer Science offers temporary bonding solutions with ...

Heidelberg Instruments has made significant performance upgrades to its renowned DWL 66+ direct-write lithography system, solidifying its position as the ultimate research ...

Yole Group announces the release of its latest report, Automotive Imaging 2025, providing a deep dive into one of the most dynamic segments of the automotive semiconductor ... Brewer Science offers ...

ELSPES Inc. has announced the successful development of its next-generation highdensity silicon capacitor, now achieving capacitance densities up to 2,500 nF/mm². This ... ELSPES Inc.