The challenge lies in ensuring uniform wafer thickness, requiring nanoscale precision in laser focus depth. Thus, Si LAL ...

China’s indium selenide wafer breakthrough marks a leap beyond silicon. It won’t upend the chip industry overnight, but ...

Wafer dicing is a crucial step in the semiconductor industry, particularly with blade sawing leading to small PPM (Parts Per Million) of chip and crack defects. This issue is intensified in Wafer ...