Fonon's Wafer Dicing System incorporates Fantom Width Laser Dicing technology (FWLD), an innovative next-generation method of splitting brittle materials without generating a visible seam.

The global thin wafer processing and dicing equipment market was valued at USD 536.71 million in 2019 and is estimated to register a CAGR of 6.44% over the forecast period (2020 ...

Summary Disco is the market leader in slicing and dicing machines used in the preparation of semiconductors, with around 70% market share. It has a solid track record of sustained growth, high ...

It all begins with silicon extraction from sand, which is then refined into silicon wafers. These wafers are the foundation of modern technology, powering everything from smartphones to computers.

The decade-long supply agreement calls for Wolfspeed to provide Renesas with 150mm silicon carbide bare and epitaxial wafers scaling in CY2025, reinforcing the companies’ vision for an industry ...

ZMC Acquires Leading Semiconductor Silicon Solutions and Services Company Pure Wafer (Scanrail - stock.adobe.com) Nov. 19, 2024 9:30 AM PT ...

Electric Vehicles EVs President Biden Michigan ev range US silicon carbide wafers just got a big boost – here’s why it matters for EVs Michelle Lewis | Feb 22 2024 - 10:59 am PT 15 Comments ...

TAIPEI — Taiwanese silicon wafer manufacturer GlobalWafers said Friday it would invest an additional $4 billion in the United States to meet growing customer demand there, as it officially ...

The U.S. Commerce Department said on Wednesday it planned to award Taiwan's GlobalWafers up to $400 million in government grants to significantly increase production of silicon wafers.