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A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for ...
This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation ...
Leading IC manufacturing and technology services provider increases chip-on-wafer (CoW) yield by 3.3% from 96.47% to 99.66% with Nordson Electronics Solutions ...
TrueFlat technology uses negative pressure reflow and Advanced Thermal Control (ATC) to reduce warpage, micro spikes, and CTE mismatch defects in ultra-miniaturized electronic assemblies with fragile ...
Innovations in Optics, Inc. (IOI) is pleased to announce the promotion of two key staff members: Joe Chevalier has been named President, and David Pierce has been ...
ASMPT introduces its latest high-performance wire bonder: the AERO PRO. Developed for high-density semiconductor designs, the AERO PRO delivers the highest bonding ... ASMPT will be exhibiting at ...
Two renowned researchers received the ZEISS Research Award at a ceremony on Thursday evening. The award went to physicists Prof. Dr. Jelena Vučković from Stanford ... The challenging geopolitical and ...
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. If you have any questions on your Thermal Warpage and ...
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. If you have any questions on your Thermal Warpage and ...
Littelfuse, Inc. announced the relaunch of its PTS647 Series Surface-Mounted Tactile Switch featuring significant design upgrades for improved noise performance, durability, ...
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. This study evaluates copper redistribution layer ...
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