The challenge lies in ensuring uniform wafer thickness, requiring nanoscale precision in laser focus depth. Thus, Si LAL ...

China’s indium selenide wafer breakthrough marks a leap beyond silicon. It won’t upend the chip industry overnight, but ...

[SMM Silicon-Based PV Morning Meeting Summary: Strong Upward Momentum in Wafer Prices, Transaction Prices of Solar Cells Rise] Wafer: The market price for N-type 18X wafers is 1 yuan/piece; the price ...

We demonstrate that counterintuitively, silicon wafer stealth dicing can be performed with femtosecond laser pulses at 1030-nm, where linear absorption predominates.

Stories about Soham Parekh, a software engineer that simultaneously works at several startups, have gone viral in the last week. Who is he?

An overview and emerging challenges in mechanical dicing of silicon (Si) wafer are discussed from view point of narrow kerf, thin wafer, chip strength enhancement, Copper (Cu)/low-k wafers and dicing ...