Innovation paves the way for a high-volume, silicon photonics 400G/lane platform to meet next-generation 3.2T optical communication architectures ...
Co-packaged optics require hybrid testing systems with reliable alignment techniques that can handle both electrical and optical signals simultaneously.
A major breakthrough at Peking University might have just found the first step beyond silicon for semiconductors.
Knowing where circuits came from, and the conditions in which they operate, can help designers optimize devices already in ...
Peking University has published its findings on a wafer-scale 2D GAAFET in Nature, pointing a new path into the Angstrom era ...
Intel's foundry business never seems far from the headlines these days, not least because various ex-executives continue to ...