This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation ...

TrueFlat technology uses negative pressure reflow and Advanced Thermal Control (ATC) to reduce warpage, micro spikes, and CTE mismatch defects in ultra-miniaturized electronic assemblies with fragile ...

Leading IC manufacturing and technology services provider increases chip-on-wafer (CoW) yield by 3.3% from 96.47% to 99.66% with Nordson Electronics Solutions ...

Semiconductor Packaging News - Exclusive: Univ. of Michigan Research Study Demonstrates Novel Synthesis Using Veeco's Fiji ALD System ...

Press Release May 21, 2025 - Click the title to read the full press release. Circuits Integrated Hellas Launches Game-Changing Kythrion™ Satcom Chipset Circuits Integrated Hellas (CIH) launched ...

Press Release May 28, 2025 - Click the title to read the full press release. Pioneering energy-efficient AI with innovative ferroelectric technology As artificial intelligence (AI) becomes ...

Indium Corporation is pleased to welcome 15 new interns into its award-winning summer internship program. Since its inception in 2012, Indium Corporation's internship ... Indium Corporation® has ...

Press Release March 28, 2025 - Click the title to read the full press release. Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels Toray Engineering Co., Ltd., has ...

For over 20 years, Infotech AG has been headquartered in Solothurn, Switzerland. Due to our remarkable success, we are excited to announce the relocation of our headquarters ... Semiconductor ...

ISE Labs, Inc. announced it is broadening customer access to its world-class capabilities with the opening of a second U.S. facility, located in San Jose, Calif. Together ...

NEOM Investment Fund (NIF) has announced a strategic investment in MemryX, a US-based leader in Edge AI semiconductor solutions. The partnership will accelerate ...