The system is designed for high-volume, rapid production of 3D packaging made from fibre-based materials.

Nvidia’s next generation of AI processors, expected under the internal code name Feynman, could become early candidates for a ...

TSMC is preparing to mass-produce panel-level packaging (PLP), a next-generation chip-packaging technology — setting up a ...

Nvidia's AI chips will be the first to rely on the new tech. According to sources familiar with the matter, TSMC is working ...

The venture’s initial product line will include paper cups, folding cartons, paper bags and other foodservice packaging ...

Packaging is more than a product vessel. It serves as a strategic tool for storytelling, trust-building, and delivering immersive brand experiences. Retailers and brands that leverage packaging as a ...

Taiwan Semiconductor Manufacturing Company recently announced a 10-year agreement with Amkor Technology to expand advanced semiconductor packaging and testing capacity in Arizona, supporting a more ...

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...

Plastipak Packaging Inc., headquartered in Plymouth, Michigan, has announced its Direct Object Printing (DOP) patented technology has earned a 2017 Silver Award for Packaging Innovation from DuPont ...

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips ...

Gain Real-World Experience: Two blocks of cooperative education provide you with hands-on, full-time paid work experience in the packaging science industry ...

STEM-OPT Visa Eligible: The STEM Optional Practical Training (OPT) program allows full-time, on-campus international students on an F-1 student visa to stay and work in the U.S. for up to three years ...