The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...
Conventional methods of characterizing and troubleshooting plasma-based thin-film processes frequently lack the ability to capture the full intricacies of the plasma system. Often, efforts rely on ...
Researchers from the University of New South Wales (UNSW) in Australia have sought to improve TOPCon solar cell efficiency by reducing the thickness of the polysilicon (poly-Si) layers used in these ...
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