Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...
Magnum Venus Products, a global manufacturer of fluid movement and production solutions for industrial applications, is launching a new process for closed molding to increase part production by ...
The alternative text for this image may have been generated using AI. Figure 2: Surface morphologies of GaAs surfaces during ELO process. The alternative text for this image may have been generated ...
Injection-molded liquid silicone rubber (LSR) is used in the manufacture of many goods, from medical devices to cookware to electronics. Many LSR applications require that the silicone be bonded to ...
New Monolithic Lens Molding (MLM) capability enables up to eight-megapixel-and-higher-resolution devices. CHIBA, Japan, Dec. 1, 2010 /PRNewswire/ -- SEMICON JAPAN -- EV Group (EVG), a leading supplier ...
Lextar Electronics will debut a package-free "white chip" LED technology that features substrate-free flip chip and phosphor molding process, and can be fabricated by ...
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