Fonon's Wafer Dicing System incorporates Fantom Width Laser Dicing technology (FWLD), an innovative next-generation method of splitting brittle materials without generating a visible seam.

New York, Feb. 21, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Thin Wafer Processing and Dicing Equipment Market - Growth, Trends, and Forecast (2020 - 2025 ...

Grinders are used to thin and prepare wafers from silicon ingots; dicing machines are used to cut wired and prepared chips on the processed wafer itself (see diagrams from Disco).

The decade-long supply agreement calls for Wolfspeed to provide Renesas with 150mm silicon carbide bare and epitaxial wafers scaling in CY2025, reinforcing the companies’ vision for an industry ...

Private equity firm ZMC has announced via press release that it has acquired a controlling stake in Pure Wafer, the largest semiconductor silicon solutions and services company in the United States.

TAIPEI — Taiwanese silicon wafer manufacturer GlobalWafers said Friday it would invest an additional $4 billion in the United States to meet growing customer demand there, as it officially ...

A Michigan manufacturer of silicon carbide (SiC) wafers, a key component in EV power electronics, just got a big loan from the US Department of Energy to ramp up production.

The U.S. Commerce Department said on Wednesday it planned to award Taiwan's GlobalWafers up to $400 million in government grants to significantly increase production of silicon wafers.