The tool aims to ease the challenges of designing intricate 3D interconnects, offering engineers a way to handle multi-die ...

The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages ...

Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity ...

Based on TrendForce’s projection that nearly 4 million Google TPUs will be shipped in 2026, demand for 800G-plus optical modules is expected to exceed 6 million units ...

Ayar Labs Inc., a startup that’s developing optical interconnects that can transmit data between computer chips via light, said today it has closed on a hefty late-stage $155 million funding round led ...

The Bull brand, regrouping Atos Group’s Advanced Computing and AI activities, was officially launched on January 29, 2026, bringing back a historically rooted technology name. Bull is a global leader ...

PLEASANTON, CA, UNITED STATES, February 10, 2026 /EINPresswire.com/ -- Inneos today announced Cheetah, a ruggedized ...

The high functional integration of system-on-chip designs today is driving the need for new technological approaches in semiconductor design. Anyone who owns a Samsung Galaxy S4, HTC One or comparable ...

Within the increasing complexity of SoC design, bus-interconnect is a key component which has led to evolution in the design of interconnect with a new socket-based approach. The socket is defined as: ...

Smiths Interconnect’s high-power burn-in socket is a specialized electromechanical interface designed to temporarily connect a semiconductor device (like a CPU, GPU, AI accelerator or high-power ...

3D Interconnect Designer simplifies high-speed 3D interconnect design for silicon bridges and interposers. As chiplet architectures are increasingly adopted, engineers face complex 3D interconnect ...