Micron Technology (NASDAQ: MU) delivered a strong set of Q3 FY’25 results (August fiscal year). Revenue rose 37% year-over-year to $9.3 billion, beating expectations, while adjusted earnings came in ...
Samsung begins HBM4 chip production for Nvidia in February 2026. Micron sold out through 2026. Tight supply benefits all ...
This reasoning has been effective for decades. Memory has consistently been among the most cyclical industries within semiconductors.
SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performance Organic substrates reduce packaging costs and relax routing constraints in HBM designs Serialization shifts ...
This article was originally published on ARPU. View the original post here. Samsung Electronics Co., a titan of the technology world, just saw its operating profit plummet by 56%, a shocking result ...
Forbes contributors publish independent expert analyses and insights. During congressional hearing in the House of Representatives’ Energy & Commerce Committee Subcommittee of Communication and ...
TL;DR: SK hynix surpassed Samsung as the top global memory chip supplier in Q2 2025, with $15.1 billion in sales and a 62% share of the HBM market. SK hynix's rising operating profits and strong ...
Memory startup d-Matrix is claiming its 3D stacked memory will be up to 10x faster and run at up to 10x greater speeds than HBM. d-Matrix's 3D digital in-memory compute (3DIMC) technology is the ...
This year, there won't be enough memory to meet worldwide demand because powerful AI chips made by the likes of Nvidia, AMD and Google need so much of it. Prices for computer memory, or RAM, are ...
High-bandwidth memory (HBM) is an important part of AI processors, handling massive data processing and computations. In response, Teradyne, Inc. has launched the Magnum 7H, a next-generation memory ...
SK Hynix said the new facility would help it meet growing demand for memory chips. The $13 billion investment will build on its existing production in Cheongju. According to industry projections cited ...
Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...
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