Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

Smaller PCBs, including rigid-flex circuits, call for die attach using one of three methodologies, depending on the application Technologies that for years were the sole domain of semiconductor ...

Venkat Nandivada, Manager of Technical Support at Master Bond Inc, talks to AZoM about die attach adhesives used in semiconductor assembly. Beyond their ability to form a tight bond between die and ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...