Hong Kong's largest government-funded R&D centre showcases 17 cutting-edge innovations aligned with the Middle East's aspirations for sustainable infrastructure, renewable energy, and smart city.HONG ...
The University of Colorado Boulder’s College of Engineering and Applied Science (CEAS) has announced the recipients of its inaugural class of Innovation & Entrepreneurship (I&E) Fellows, a new program ...
Industry’s first use of ruthenium in high-volume production enables copper chip wiring to be scaled to the 2nm node and beyond and reduces resistance by as much as 25% New enhanced low-k dielectric ...
On behalf of the College of Engineering and Applied Science (CEAS) and Venture Partners, I am pleased to announce the 2026 CEAS Innovation & Entrepreneurship (I&E) Fellowship Program. In line with the ...
The Nature Index tracks primary research articles from 178 applied, health, natural and social sciences journals, across many different publishers, chosen by an independent group of researchers. The ...
Applied Materials has revealed chip wiring innovations that will help address challenges in the way of energy-efficient computing. The use of new materials in chip wiring will enable two-nanometer ...
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