Courtesy of www.MikeHolt.com. This article is the fifth in a 12-part series on the differences between grounding and bonding. Let us start our discussion by focusing on the bonding requirements for ...
A novel negative-tone, photosensitive, polymeric bonding material is proposed that can be used as a dielectric enabling polymer/metal hybrid bonding. August 18th, 2022 - By: Brewer Science Wafer-level ...
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